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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages 1999 edition
Gerard Kelly
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The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages 1999 edition
Gerard Kelly
One of the greatest challenges facing package manufacturers is to develop reliable fine pitch thin packages with high leadcounts, capable of dissipating heat, and deliver them in volume to the market in a very short space of time.
134 pages, biography
| Media | Books Hardcover Book (Book with hard spine and cover) |
| Released | April 30, 1999 |
| ISBN13 | 9780792384854 |
| Publishers | Springer |
| Pages | 134 |
| Dimensions | 170 × 244 × 11 mm · 408 g |
| Language | English |
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