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Direct Copper Interconnection for Advanced Semiconductor Technology
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Direct Copper Interconnection for Advanced Semiconductor Technology
In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.
| Medij | Knjige Paperback Book (Knjiga z mehkimi platnicami in lepljenim hrbtom) |
| Pred izidom | 22. maja 2026 |
| ISBN13 | 9781032528403 |
| Založniki | Taylor & Francis Ltd |
| Strani | 448 |
| Dimenzije | 150 × 220 × 10 mm · 850 g |
| Urednik | Shangguan, Dongkai |
