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Materials for Advanced Semiconductor Packaging and Heterogeneous Integration
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Predvidena dobava 28. okt 2026 - 2. nov 2026
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Materials for Advanced Semiconductor Packaging and Heterogeneous Integration
This book offers a comprehensive review of the key topics and the latest advancements in innovative materials for advanced semiconductor packaging and heterogeneous integration.
| Medij | Knjige Hardcover Book (Knjiga s trdim hrbtom in platnicami) |
| Pred izidom | 20. oktobra 2026 |
| ISBN13 | 9781032959436 |
| Založniki | Taylor & Francis Ltd |
| Strani | 486 |
| Dimenzije | 150 × 220 × 20 mm · 453 g |
| Urednik | Shangguan, Dongkai |
