3D Stacked Chips: From Emerging Processes to Heterogeneous Systems -  - Knjige - Springer International Publishing AG - 9783319793054 - 26. maja 2018
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3D Stacked Chips: From Emerging Processes to Heterogeneous Systems Softcover reprint of the original 1st ed. 2016 edition

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This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.


339 pages, 193 Tables, color; 22 Tables, black and white; 157 Illustrations, color; 81 Illustrations

Medij Knjige     Paperback Book   (Knjiga z mehkimi platnicami in lepljenim hrbtom)
Izdano 26. maja 2018
ISBN13 9783319793054
Založniki Springer International Publishing AG
Strani 339
Dimenzije 150 × 220 × 10 mm   ·   508 g
Jezik Nemščina  
Urednik Elfadel, Ibrahim (Abe) M.
Urednik Fettweis, Gerhard

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