Povej prijatelju o tem izdelku:
3D Stacked Chips: From Emerging Processes to Heterogeneous Systems Softcover reprint of the original 1st ed. 2016 edition
3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl.
339 pages, 193 Tables, color; 22 Tables, black and white; 157 Illustrations, color; 81 Illustrations
| Medij | Knjige Paperback Book (Knjiga z mehkimi platnicami in lepljenim hrbtom) |
| Izdano | 26. maja 2018 |
| ISBN13 | 9783319793054 |
| Založniki | Springer International Publishing AG |
| Strani | 339 |
| Dimenzije | 150 × 220 × 10 mm · 508 g |
| Jezik | Nemščina |
| Urednik | Elfadel, Ibrahim (Abe) M. |
| Urednik | Fettweis, Gerhard |