Povej prijatelju o tem izdelku:
Microelectronics Packaging Handbook: Subsystem Packaging Part III R.R. Tummala 2nd ed. 1997 edition
Microelectronics Packaging Handbook: Subsystem Packaging Part III
R.R. Tummala
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages.
657 pages, biography
| Medij | Knjige Hardcover Book (Knjiga s trdim hrbtom in platnicami) |
| Izdano | 31. januarja 1997 |
| ISBN13 | 9780412084515 |
| Založniki | Chapman and Hall |
| Strani | 628 |
| Dimenzije | 155 × 235 × 36 mm · 993 g |
| Jezik | Angleščina Francoščina |