Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly - Jennie Hwang - Knjige - Van Nostrand Reinhold Inc.,U.S. - 9780442013530 - 24. septembra 1992
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Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly New edition

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One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.


456 pages, 77 black & white illustrations, biography

Medij Knjige     Paperback Book   (Knjiga z mehkimi platnicami in lepljenim hrbtom)
Izdano 24. septembra 1992
ISBN13 9780442013530
Založniki Van Nostrand Reinhold Inc.,U.S.
Strani 456
Dimenzije 152 × 229 × 24 mm   ·   639 g
Jezik Angleščina  

Več od istega **izdajatelja**