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Benefiting from Thermal and Mechanical Simulation in Micro-electronics O De Saint Leger
Benefiting from Thermal and Mechanical Simulation in Micro-electronics
O De Saint Leger
Presents papers from the international conference on this topic, EuroSimE2000. This book discusses thermal and mechanical related problems and challenges in micro-electronics. It is useful for students at graduate level and beyond, and for researchers, designers and specialists in the fields of microelectronics and mechanics.
192 pages, biography
| Medij | Knjige Hardcover Book (Knjiga s trdim hrbtom in platnicami) |
| Izdano | 31. decembra 2000 |
| ISBN13 | 9780792372783 |
| Založniki | Kluwer Academic Publishers |
| Strani | 192 |
| Dimenzije | 155 × 235 × 12 mm · 498 g |
| Jezik | Angleščina |
| Urednik | Ernst, L.j. |
| Urednik | Leger, O.de Saint |
| Urednik | Zhang, G.q |