Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging - John W. Mccormick - Books - Springer - 9780792376767 - January 31, 2003
In case cover and title do not match, the title is correct

Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging 2003 edition

John W. Mccormick

Price
$ 194.24

Ordered from remote warehouse

Expected delivery Aug 6 - 15

Our customers say:

14-day return policy in accordance with European consumer protection law
Top ranking on Trustpilot
Add to your iMusic wish list

Foldable Flex and Thinned Silicon Multichip Packaging Technology - Emerging Technology in Advanced Packaging 2003 edition

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex).

347 pages, 266 black & white illustrations, biography

Media Books     Hardcover Book   (Book with hard spine and cover)
Released January 31, 2003
ISBN13 9780792376767
Publishers Springer
Pages 347
Dimensions 155 × 235 × 22 mm   ·   743 g
Language English  
Editor Balde, John W.

See all of John W. Mccormick ( e.g. Hardcover Book )