Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing and Software Development - Way Kuo - Knjige - Kluwer Academic Publishers - 9780792381075 - 31. januarja 1998
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Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing and Software Development 1998 edition

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Explains reliability issues in microelectronics systems manufacturing and software development with an emphasis on evolving manufacturing technology for the semiconductor industry. This book presents ways to systematically analyze burn-in policy at the component, sub-system, and system levels.


420 pages, biography

Medij Knjige     Hardcover Book   (Knjiga s trdim hrbtom in platnicami)
Izdano 31. januarja 1998
ISBN13 9780792381075
Založniki Kluwer Academic Publishers
Strani 420
Dimenzije 156 × 234 × 23 mm   ·   734 g
Jezik Angleščina  

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