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Recent Trends in VLSI and Semiconductor Packaging
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Recent Trends in VLSI and Semiconductor Packaging
The Conference aimed to provide a platform for researchers, academicians, industry experts, and practitioners to exchange ideas, present research findings, and discuss emerging trends and challenges in the specified fields.
| Medij | Knjige Paperback Book (Knjiga z mehkimi platnicami in lepljenim hrbtom) |
| Izdano | 6. maja 2025 |
| ISBN13 | 9781041017875 |
| Založniki | Taylor & Francis Ltd |
| Strani | 616 |
| Dimenzije | 150 × 220 × 10 mm · 1,56 kg |
| Jezik | Angleščina |
| Urednik | Rao, K. Madhava |
| Urednik | Reddy, T. Vasudeva |
