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Solder Joint Reliability: Theory and Applications John H. Lau Softcover reprint of the original 1st ed. 1991 edition
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Solder Joint Reliability: Theory and Applications
John H. Lau
New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.
652 pages, 146 black & white illustrations, biography
| Medij | Knjige Paperback Book (Knjiga z mehkimi platnicami in lepljenim hrbtom) |
| Izdano | 23. februarja 2014 |
| ISBN13 | 9781461367437 |
| Založniki | Springer-Verlag New York Inc. |
| Strani | 631 |
| Dimenzije | 155 × 235 × 34 mm · 902 g |
| Jezik | Angleščina |
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