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Manufacturing Challenges in Electronic Packaging Y C Lee Softcover reprint of the original 1st ed. 1998 edition
Manufacturing Challenges in Electronic Packaging
Y C Lee
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements.
261 pages, biography
| Medij | Knjige Paperback Book (Knjiga z mehkimi platnicami in lepljenim hrbtom) |
| Izdano | 25. septembra 2012 |
| ISBN13 | 9781461376590 |
| Založniki | Springer-Verlag New York Inc. |
| Strani | 261 |
| Dimenzije | 155 × 235 × 14 mm · 390 g |
| Jezik | Angleščina |
| Urednik | Chen, W.T. |
| Urednik | Lee, Y.C. |