Heat Management in Integrated Circuits: On-chip and system-level monitoring and cooling - Materials, Circuits and Devices - Ogrenci-Memik, Seda (Associate Professor, Northwestern University, Electrical Engineering and Computer Science Department, USA) - Books - Institution of Engineering and Technolog - 9781849199346 - December 1, 2015
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Heat Management in Integrated Circuits: On-chip and system-level monitoring and cooling - Materials, Circuits and Devices

Ogrenci-Memik, Seda (Associate Professor, Northwestern University, Electrical Engineering and Computer Science Department, USA)

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Heat Management in Integrated Circuits: On-chip and system-level monitoring and cooling - Materials, Circuits and Devices

This essential overview covers the subject of thermal monitoring and management in integrated circuits. Specifically, it focuses on devices and materials that are intimately integrated on-chip (as opposed to in-package or on-board) for the purposes of thermal monitoring and thermal management.

304 pages

Media Books     Hardcover Book   (Book with hard spine and cover)
Released December 1, 2015
ISBN13 9781849199346
Publishers Institution of Engineering and Technolog
Pages 264
Dimensions 245 × 165 × 20 mm   ·   589 g

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