Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes - Ehrenfried Zschech - Knjige - Springer London Ltd - 9781849969673 - 22. oktobra 2010
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Materials for Information Technology: Devices, Interconnects and Packaging - Engineering Materials and Processes Softcover reprint of hardcover 1st ed. 2005 edition

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This book provides an up to date survey of the state of the art of research into the materials used in information technology, and will be bought by researchers in universities, institutions as well as research workers in the semiconductor and IT industries.


508 pages, 72 black & white tables, biography

Medij Knjige     Paperback Book   (Knjiga z mehkimi platnicami in lepljenim hrbtom)
Izdano 22. oktobra 2010
ISBN13 9781849969673
Založniki Springer London Ltd
Strani 508
Dimenzije 155 × 235 × 27 mm   ·   734 g
Jezik Angleščina  
Urednik Mikolajick, Thomas
Urednik Whelan, Caroline
Urednik Zschech, Ehrenfried

Več od istega **izdajatelja**