Povej prijatelju o tem izdelku:
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing Seonho Seok Softcover Reprint of the Original 1st 2018 edition
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing
Seonho Seok
| Medij | Knjige Paperback Book (Knjiga z mehkimi platnicami in lepljenim hrbtom) |
| Izdano | 5. januarja 2019 |
| ISBN13 | 9783030085612 |
| Založniki | Springer Nature Switzerland AG |
| Strani | 115 |
| Dimenzije | 150 × 220 × 10 mm · 185 g |
| Jezik | Nemščina |