Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing - Seonho Seok - Knjige - Springer Nature Switzerland AG - 9783030085612 - 5. januarja 2019
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing Softcover Reprint of the Original 1st 2018 edition

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Medij Knjige     Paperback Book   (Knjiga z mehkimi platnicami in lepljenim hrbtom)
Izdano 5. januarja 2019
ISBN13 9783030085612
Založniki Springer Nature Switzerland AG
Strani 115
Dimenzije 150 × 220 × 10 mm   ·   185 g
Jezik Nemščina  

Več od istega **izdajatelja**