Povej prijatelju o tem izdelku:
Advanced Thermal Stress Analysis of Smart Materials and Structures - Structural Integrity Zengtao Chen 2020 edition
Advanced Thermal Stress Analysis of Smart Materials and Structures - Structural Integrity
Zengtao Chen
This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures.
304 pages, 10 Tables, color; 44 Illustrations, color; 60 Illustrations, black and white; X, 304 p. 1
| Medij | Knjige Paperback Book (Knjiga z mehkimi platnicami in lepljenim hrbtom) |
| Izdano | 19. septembra 2020 |
| ISBN13 | 9783030252038 |
| Založniki | Springer Nature Switzerland AG |
| Strani | 304 |
| Dimenzije | 233 × 155 × 26 mm · 482 g |
| Jezik | Nemščina |