Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics - Jong-Hoon Lee - Knjige - Springer International Publishing AG - 9783031005756 - 31. decembra 2007
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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics

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Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References


108 pages, X, 108 p.

Medij Knjige     Paperback Book   (Knjiga z mehkimi platnicami in lepljenim hrbtom)
Izdano 31. decembra 2007
ISBN13 9783031005756
Založniki Springer International Publishing AG
Strani 108
Dimenzije 190 × 235 × 12 mm   ·   240 g
Jezik Angleščina  

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