Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics - Jong-Hoon Lee - Books - Springer International Publishing AG - 9783031005756 - December 31, 2007
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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics

Jong-Hoon Lee

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Three-Dimensional Integration and Modeling: A Revolution in RF and Wireless Packaging - Synthesis Lectures on Computational Electromagnetics

Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References

108 pages, X, 108 p.

Media Books     Paperback Book   (Book with soft cover and glued back)
Released December 31, 2007
ISBN13 9783031005756
Publishers Springer International Publishing AG
Pages 108
Dimensions 241 g
Language English  
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