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Die-stacking Architecture - Synthesis Lectures on Computer Architecture Yuan Xie
Die-stacking Architecture - Synthesis Lectures on Computer Architecture
Yuan Xie
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors.
| Medij | Knjige Paperback Book (Knjiga z mehkimi platnicami in lepljenim hrbtom) |
| Izdano | 10. junija 2015 |
| ISBN13 | 9783031006197 |
| Založniki | Springer International Publishing AG |
| Strani | 113 |
| Dimenzije | 150 × 220 × 10 mm · 231 g |
| Jezik | Angleščina |