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CMOS Plasma and Process Damage Kirk Prall
CMOS Plasma and Process Damage
Kirk Prall
Readers will learn how plasma and process damage results from the high-energy processes that are used in chip manufacturing, causing harm to the chips, functional failure and reliability problems.
| Medij | Knjige Hardcover Book (Knjiga s trdim hrbtom in platnicami) |
| Izdano | 17. maja 2025 |
| ISBN13 | 9783031890284 |
| Založniki | Springer International Publishing AG |
| Strani | 466 |
| Dimenzije | 150 × 220 × 20 mm · 891 g |
| Jezik | Nemščina |