Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs - Brandon Noia - Knjige - Springer International Publishing AG - 9783319023779 - 2. decembra 2013
Če se naslovnica in naslov ne ujemata, je naslov pravilen

Brandon Noia
Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs 2014 edition

Cena
€ 111,49

Naročeno iz oddaljenega skladišča

Predvidena dobava 31. avg - 14. sep
Prejemajte obvestila o novih izdajah izvajalca Brandon Noia

Kaj pravijo naše stranke:

14-dnevna politika vračila v skladu z evropsko zakonodajo o varstvu potrošnikov
Najvišja ocena na Trustpilot
Dodaj na svoj seznam želja iMusic

Not rated yet

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain.

274 pages, 18 black & white illustrations, 115 colour illustrations, 23 black & white tables, biogra

Medij Knjige     Hardcover Book   (Knjiga s trdim hrbtom in platnicami)
Izdano 2. decembra 2013
ISBN13 9783319023779
Založniki Springer International Publishing AG
Strani 245
Dimenzije 157 × 243 × 16 mm   ·   657 g
Jezik Nemščina  

Več od istega **izdajatelja**

Ogled vseh Brandon Noia ( Na primer Hardcover Book in Paperback Book )