Arbitrary Modeling of Tsvs for 3D Integrated Circuits - Analog Circuits and Signal Processing - Khaled Salah - Knjige - Springer International Publishing AG - 9783319076102 - 5. septembra 2014
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Khaled Salah
Arbitrary Modeling of Tsvs for 3D Integrated Circuits - Analog Circuits and Signal Processing 2015 Edition

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This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, Macro modeling, dimensional analysis and compact modeling, as well as closed form equations for the through silicon via parasitics. Concepts covered are demonstrated by using TSVs in applications such as a spiral inductor and inductive-based communication system and bandpass filtering.

271 pages, 60 black & white illustrations, 99 colour illustrations, 58 black & white tables, 5 colou

Medij Knjige     Hardcover Book   (Knjiga s trdim hrbtom in platnicami)
Izdano 5. septembra 2014
ISBN13 9783319076102
Založniki Springer International Publishing AG
Strani 271
Dimenzije 155 × 235 × 13 mm   ·   449 g
Jezik Angleščina  

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Ogled vseh Khaled Salah