Ran Wang
Testing of Interposer-Based 2.5D Integrated Circuits Ran Wang 1st ed. 2017 edition

Name: Testing of Interposer-Based 2.5D Integrated Circuits
Price: 111.49 EUR
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Author: Ran Wang

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Testing of Interposer-Based 2.5D Integrated Circuits

Ran Wang

1st ed. 2017 edition

The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.

182 pages, 50 Tables, color; 102 Illustrations, color; 16 Illustrations, black and white; XIV, 182 p

Medij	Knjige Hardcover Book (Knjiga s trdim hrbtom in platnicami)
Izdano	29. marca 2017
ISBN13	9783319547138
Založniki	Springer International Publishing AG
Strani	182
Dimenzije	150 × 220 × 20 mm · 453 g
Jezik	Nemščina