3D Microelectronic Packaging: From Fundamentals to Applications - Springer Series in Advanced Microelectronics - Yan Li - Knjige - Springer International Publishing AG - 9783319830865 - 13. julija 2018
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3D Microelectronic Packaging: From Fundamentals to Applications - Springer Series in Advanced Microelectronics Softcover reprint of the original 1st ed. 2017 edition

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This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages.


463 pages, 253 Illustrations, color; 78 Illustrations, black and white; IX, 463 p. 331 illus., 253 i

Medij Knjige     Paperback Book   (Knjiga z mehkimi platnicami in lepljenim hrbtom)
Izdano 13. julija 2018
ISBN13 9783319830865
Založniki Springer International Publishing AG
Strani 463
Dimenzije 150 × 220 × 10 mm   ·   662 g
Jezik Nemščina  
Urednik Goyal, Deepak
Urednik Li, Yan

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