Testing of Interposer-Based 2.5D Integrated Circuits - Ran Wang - Knjige - Springer International Publishing AG - 9783319854618 - 9. maja 2018
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Testing of Interposer-Based 2.5D Integrated Circuits Softcover reprint of the original 1st ed. 2017 edition

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The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.


182 pages, 50 Tables, color; 102 Illustrations, color; 16 Illustrations, black and white; XIV, 182 p

Medij Knjige     Paperback Book   (Knjiga z mehkimi platnicami in lepljenim hrbtom)
Izdano 9. maja 2018
ISBN13 9783319854618
Založniki Springer International Publishing AG
Strani 182
Dimenzije 150 × 220 × 10 mm   ·   285 g
Jezik Nemščina  

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