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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales Jianfeng Luo Softcover reprint of hardcover 1st ed. 2004 edition
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication: From Particle Scale to Feature, Die and Wafer Scales
Jianfeng Luo
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example.
335 pages, biography
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | December 15, 2010 |
| ISBN13 | 9783642061158 |
| Publishers | Springer-Verlag Berlin and Heidelberg Gm |
| Pages | 311 |
| Dimensions | 155 × 235 × 17 mm · 471 g |
| Language | German |
See all of Jianfeng Luo ( e.g. Hardcover Book and Paperback Book )