3D Microelectronic Packaging: From Architectures to Applications - Springer Series in Advanced Microelectronics - - Knjige - Springer Verlag, Singapore - 9789811570896 - 24. novembra 2020
Če se naslovnica in naslov ne ujemata, je naslov pravilen

3D Microelectronic Packaging: From Architectures to Applications - Springer Series in Advanced Microelectronics Second Edition 2021 edition

Prejmite e-pošto, ko bo izdelek na voljo
Do you have a profile? Prijava

Kaj pravijo naše stranke:

14-dnevna politika vračila v skladu z evropsko zakonodajo o varstvu potrošnikov
Najvišja ocena na Trustpilot
Dodaj na svoj seznam želja iMusic

Not rated yet

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging.

622 pages, 100 Tables, color; 205 Illustrations, color; 94 Illustrations, black and white; XVII, 622

Medij Knjige     Hardcover Book   (Knjiga s trdim hrbtom in platnicami)
Izdano 24. novembra 2020
ISBN13 9789811570896
Založniki Springer Verlag, Singapore
Strani 622
Dimenzije 150 × 220 × 20 mm   ·   1,12 kg
Urednik Goyal, Deepak
Urednik Li, Yan

Več od istega **izdajatelja**