Povej prijatelju o tem izdelku:
Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology Cher Ming Tan 2013 edition
Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology
Cher Ming Tan
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.
120 pages, 73 black & white illustrations, 2 colour illustrations, biography
| Medij | Knjige Paperback Book (Knjiga z mehkimi platnicami in lepljenim hrbtom) |
| Izdano | 4. maja 2013 |
| ISBN13 | 9789814451208 |
| Založniki | Springer Verlag, Singapore |
| Strani | 103 |
| Dimenzije | 155 × 235 × 6 mm · 1,88 kg |
Več od Cher Ming Tan
Prikaži vseVeč od istega **izdajatelja**
Ogled vseh Cher Ming Tan ( Na primer Hardcover Book in Paperback Book )