Tell your friends about this item:
Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology 2013 edition
Cher Ming Tan
Price
$ 69.29
Ordered from remote warehouse
Expected delivery May 26 - Jun 5
Our customers say:
Add to your iMusic wish list
Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology 2013 edition
Cher Ming Tan
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.
120 pages, 73 black & white illustrations, 2 colour illustrations, biography
| Media | Books Paperback Book (Book with soft cover and glued back) |
| Released | May 4, 2013 |
| ISBN13 | 9789814451208 |
| Publishers | Springer Verlag, Singapore |
| Pages | 103 |
| Dimensions | 155 × 235 × 6 mm · 1.88 kg |
![Cover for Cher Ming Tan · Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections - Springer Series in Reliability Engineering (Paperback Book) [2011 edition] (2013)](https://imusic.b-cdn.net/images/item/original/416/9781447126416.jpg?cher-ming-tan-2013-applications-of-finite-element-methods-for-reliability-studies-on-ulsi-interconnections-springer-series-in-reliability-engineering-paperback-book&class=scaled&v=1410620946)
![Cover for Cher Ming Tan · Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections - Springer Series in Reliability Engineering (Hardcover Book) [2011 edition] (2011)](https://imusic.b-cdn.net/images/item/original/091/9780857293091.jpg?cher-ming-tan-2011-applications-of-finite-element-methods-for-reliability-studies-on-ulsi-interconnections-springer-series-in-reliability-engineering-hardcover-book&class=scaled&v=1394616648)
