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Izdaja: Zhang, Shuye (Associate Professor, Harbin Institute of Technology, China)

Cover for Zhang, Shuye (Associate Professor, Harbin Institute of Technology, China) · Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging - Materials, Circuits and Devices (Hardcover Book) (2025)

Thermomechanical Simulation Meth... (2025)

Zhang, Shuye (Associate Professo...