Fundamentals of Microsystems Packaging - Rao Tummala - Knjige - McGraw-Hill Education - Europe - 9780071371698 - 29. maja 2001
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Fundamentals of Microsystems Packaging Ed edition


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Suitable for engineers, technicians, and students, this book teaches microsystems packaging. It covers the field from wafer to systems, including various major contributing technologies. It features a comprehensive tutorial covering various major aspects of microelectronics, photonics, RF, packaging design, assembly, reliability, and, testing.


967 pages, 150 Illustrations, unspecified

Medij Knjige     Hardcover Book   (Knjiga s trdim hrbtom in platnicami)
Izdano 29. maja 2001
ISBN13 9780071371698
Založniki McGraw-Hill Education - Europe
Strani 967
Dimenzije 234 × 338 × 64 mm   ·   1,87 kg
Jezik Angleščina  

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