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Fundamentals of Microsystems Packaging Rao Tummala Ed edition
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Fundamentals of Microsystems Packaging
Rao Tummala
Suitable for engineers, technicians, and students, this book teaches microsystems packaging. It covers the field from wafer to systems, including various major contributing technologies. It features a comprehensive tutorial covering various major aspects of microelectronics, photonics, RF, packaging design, assembly, reliability, and, testing.
967 pages, 150 Illustrations, unspecified
| Medij | Knjige Hardcover Book (Knjiga s trdim hrbtom in platnicami) |
| Izdano | 29. maja 2001 |
| ISBN13 | 9780071371698 |
| Založniki | McGraw-Hill Education - Europe |
| Strani | 967 |
| Dimenzije | 234 × 338 × 64 mm · 1,87 kg |
| Jezik | Angleščina |