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Area Array Packaging Processes - Ken Gilleo - Books - McGraw-Hill - 9780071738019 - October 23, 2003
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Ken Gilleo
Area Array Packaging Processes

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This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

Media Books     Paperback Book   (Book with soft cover and glued back)
Released October 23, 2003
ISBN13 9780071738019
Publishers McGraw-Hill
Pages 272
Dimensions 231 × 14 × 188 mm   ·   471 g
Language English  

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