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Through Silicon Vias: Materials, Models, Design, and Performance Brajesh Kumar Kaushik 1. izdaja
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Through Silicon Vias: Materials, Models, Design, and Performance
Brajesh Kumar Kaushik
Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph
216 pages
| Medij | Knjige Paperback Book (Knjiga z mehkimi platnicami in lepljenim hrbtom) |
| Izdano | 30. junija 2020 |
| ISBN13 | 9780367574543 |
| Založniki | Taylor & Francis Ltd |
| Strani | 216 |
| Dimenzije | 150 × 220 × 10 mm · 453 g |
| Jezik | Angleščina |
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