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Solder Joint Reliability Prediction for Multiple Environments Andrew E. Perkins 2009 edition
Solder Joint Reliability Prediction for Multiple Environments
Andrew E. Perkins
Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.
192 pages, 70 black & white illustrations, 37 black & white tables, biography
| Medij | Knjige Hardcover Book (Knjiga s trdim hrbtom in platnicami) |
| Izdano | 23. oktobra 2008 |
| ISBN13 | 9780387793931 |
| Založniki | Springer-Verlag New York Inc. |
| Strani | 192 |
| Dimenzije | 155 × 235 × 12 mm · 417 g |
| Jezik | Angleščina |