Wafer Level 3-D ICs Process Technology - Integrated Circuits and Systems - Chuan Seng Tan - Knjige - Springer-Verlag New York Inc. - 9781441945624 - 8. decembra 2010
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Chuan Seng Tan
Wafer Level 3-D ICs Process Technology - Integrated Circuits and Systems 1st ed. Softcover of orig. ed. 2009 edition

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This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology.

376 pages, 25 black & white tables, biography

Medij Knjige     Paperback Book   (Knjiga z mehkimi platnicami in lepljenim hrbtom)
Izdano 8. decembra 2010
ISBN13 9781441945624
Založniki Springer-Verlag New York Inc.
Strani 410
Dimenzije 155 × 235 × 19 mm   ·   526 g
Urednik Gutmann, Ronald J.
Urednik Reif, L. Rafael
Urednik Tan, Chuan Seng

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