Wafer Level 3-D ICs Process Technology - Integrated Circuits and Systems - Chuan Seng Tan - Knjige - Springer-Verlag New York Inc. - 9780387765327 - 19. septembra 2008
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Wafer Level 3-D ICs Process Technology - Integrated Circuits and Systems 2009 edition

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This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology.


376 pages, 25 black & white tables, biography

Medij Knjige     Hardcover Book   (Knjiga s trdim hrbtom in platnicami)
Izdano 19. septembra 2008
ISBN13 9780387765327
Založniki Springer-Verlag New York Inc.
Strani 410
Dimenzije 166 × 241 × 23 mm   ·   657 g
Jezik Angleščina  
Urednik Gutmann, Ronald J.
Urednik Reif, L. Rafael
Urednik Tan, Chuan Seng

Več od istega **izdajatelja**