Solder Joint Reliability Prediction for Multiple Environments - Andrew E. Perkins - Knjige - Springer-Verlag New York Inc. - 9781441946348 - 5. novembra 2010
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Solder Joint Reliability Prediction for Multiple Environments Softcover reprint of hardcover 1st ed. 2009 edition

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Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments.


192 pages, 70 black & white illustrations, 37 black & white tables, biography

Medij Knjige     Paperback Book   (Knjiga z mehkimi platnicami in lepljenim hrbtom)
Izdano 5. novembra 2010
ISBN13 9781441946348
Založniki Springer-Verlag New York Inc.
Strani 192
Dimenzije 155 × 235 × 11 mm   ·   299 g
Jezik Angleščina  

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