Povej prijatelju o tem izdelku:
Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development Way Kuo Softcover Reprint of the Original 1st Ed. 1998 edition
Reliability, Yield, and Stress Burn-in: a Unified Approach for Microelectronics Systems Manufacturing & Software Development
Way Kuo
420 pages, biography
| Medij | Knjige Paperback Book (Knjiga z mehkimi platnicami in lepljenim hrbtom) |
| Izdano | 14. marca 2014 |
| ISBN13 | 9781461375968 |
| Založniki | Springer-Verlag New York Inc. |
| Strani | 420 |
| Dimenzije | 155 × 235 × 22 mm · 589 g |
| Jezik | Angleščina |