Three Dimensional System Integration: IC Stacking Process and Design - Antonis Papanikolaou - Knjige - Springer-Verlag New York Inc. - 9781489981820 - 2. septembra 2014
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Antonis Papanikolaou
Three Dimensional System Integration: IC Stacking Process and Design 2011 edition

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Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life.

246 pages, biography

Medij Knjige     Paperback Book   (Knjiga z mehkimi platnicami in lepljenim hrbtom)
Izdano 2. septembra 2014
ISBN13 9781489981820
Založniki Springer-Verlag New York Inc.
Strani 246
Dimenzije 155 × 235 × 14 mm   ·   394 g
Jezik Angleščina  
Urednik Papanikolaou, Antonis
Urednik Radojcic, Riko
Urednik Soudris, Dimitrios

Več od istega **izdajatelja**

Ogled vseh Antonis Papanikolaou ( Na primer Hardcover Book in Paperback Book )