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3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization Lennart Bamberg 2022 edition
3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization
Lennart Bamberg
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
395 pages, 100 Illustrations, color; 2 Illustrations, black and white; XXV, 395 p. 102 illus., 100 i
| Medij | Knjige Hardcover Book (Knjiga s trdim hrbtom in platnicami) |
| Izdano | 28. junija 2022 |
| ISBN13 | 9783030982287 |
| Založniki | Springer Nature Switzerland AG |
| Strani | 395 |
| Dimenzije | 150 × 220 × 20 mm · 766 g |
| Jezik | Nemščina |