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3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization Lennart Bamberg 2022 edition
3D Interconnect Architectures for Heterogeneous Technologies: Modeling and Optimization
Lennart Bamberg
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration.
395 pages, 100 Illustrations, color; 2 Illustrations, black and white; XXV, 395 p. 102 illus., 100 i
| Medij | Knjige Paperback Book (Knjiga z mehkimi platnicami in lepljenim hrbtom) |
| Izdano | 29. junija 2023 |
| ISBN13 | 9783030982317 |
| Založniki | Springer Nature Switzerland AG |
| Strani | 395 |
| Dimenzije | 150 × 220 × 10 mm · 589 g |
| Jezik | Nemščina |
Več od istega **izdajatelja**
Ogled vseh Lennart Bamberg ( Na primer Hardcover Book in Paperback Book )