New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation - Synthesis Lectures on Emerging Engineering Technologies - Nabil Shovon Ashraf - Books - Springer International Publishing AG - 9783031008993 - February 16, 2016
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New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation - Synthesis Lectures on Emerging Engineering Technologies

Nabil Shovon Ashraf

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New Prospects of Integrating Low Substrate Temperatures with Scaling-Sustained Device Architectural Innovation - Synthesis Lectures on Emerging Engineering Technologies

In order to sustain Moore's Law-based device scaling, principal attention has focused on toward device architectural innovations for improved device performance as per ITRS projections for technology nodes up to 10 nm. Efficient integration of lower substrate temperatures (

Media Books     Paperback Book   (Book with soft cover and glued back)
Released February 16, 2016
ISBN13 9783031008993
Publishers Springer International Publishing AG
Pages 72
Dimensions 176 g
Language English  
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