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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing Seonho Seok 2018 edition
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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method - Springer Series in Advanced Manufacturing
Seonho Seok
115 pages, 106 Illustrations, black and white; VIII, 115 p. 106 illus.
| Medij | Knjige Hardcover Book (Knjiga s trdim hrbtom in platnicami) |
| Izdano | 14. maja 2018 |
| ISBN13 | 9783319778716 |
| Založniki | Springer International Publishing AG |
| Strani | 115 |
| Dimenzije | 150 × 220 × 20 mm · 353 g |
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