Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics - Jan A. Dziuban - Knjige - Springer - 9789048171514 - 25. novembra 2010
Če se naslovnica in naslov ne ujemata, je naslov pravilen

Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics Softcover reprint of hardcover 1st ed. 2006 edition

Cena
€ 170,49

Naročeno iz oddaljenega skladišča

Predvidena dobava 13. - 27. avg
Prejemajte obvestila o novih izdajah izvajalca Jan A. Dziuban
Dodaj na svoj seznam želja iMusic

Not rated yet

Na voljo tudi kot:

This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice.


334 pages, biography

Medij Knjige     Paperback Book   (Knjiga z mehkimi platnicami in lepljenim hrbtom)
Izdano 25. novembra 2010
ISBN13 9789048171514
Založniki Springer
Strani 334
Dimenzije 155 × 235 × 18 mm   ·   494 g
Jezik Angleščina  

Več od istega **izdajatelja**