Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics - Jan A. Dziuban - Knjige - Springer-Verlag New York Inc. - 9781402045783 - 13. junija 2006
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Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics

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This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice.


334 pages, biography

Medij Knjige     Hardcover Book   (Knjiga s trdim hrbtom in platnicami)
Izdano 13. junija 2006
ISBN13 9781402045783
Založniki Springer-Verlag New York Inc.
Strani 334
Dimenzije 156 × 235 × 20 mm   ·   771 g
Jezik Angleščina  

Več od istega **izdajatelja**