Povej prijatelju o tem izdelku:
Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics Jan A. Dziuban
Bonding in Microsystem Technology - Springer Series in Advanced Microelectronics
Jan A. Dziuban
This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice.
334 pages, biography
| Medij | Knjige Hardcover Book (Knjiga s trdim hrbtom in platnicami) |
| Izdano | 13. junija 2006 |
| ISBN13 | 9781402045783 |
| Založniki | Springer-Verlag New York Inc. |
| Strani | 334 |
| Dimenzije | 156 × 235 × 20 mm · 771 g |
| Jezik | Angleščina |
Več od istega **izdajatelja**
Ogled vseh Jan A. Dziuban ( Na primer Hardcover Book in Paperback Book )