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Integrated Circuit Packaging, Assembly and Interconnections William Greig 2007 edition
Integrated Circuit Packaging, Assembly and Interconnections
William Greig
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing.
300 pages, 75 black & white illustrations, biography
| Medij | Knjige Hardcover Book (Knjiga s trdim hrbtom in platnicami) |
| Izdano | 30. marca 2007 |
| ISBN13 | 9780387281537 |
| Založniki | Springer-Verlag New York Inc. |
| Strani | 300 |
| Dimenzije | 155 × 235 × 19 mm · 662 g |
| Jezik | Angleščina |