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Arbitrary Modeling of TSVs for 3D Integrated Circuits - Analog Circuits and Signal Processing Khaled Salah Softcover reprint of the original 1st ed. 2015 edition
Arbitrary Modeling of TSVs for 3D Integrated Circuits - Analog Circuits and Signal Processing
Khaled Salah
This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits.
188 pages, 60 black & white illustrations, 99 colour illustrations, 58 black & white tables, 5 colou
| Medij | Knjige Paperback Book (Knjiga z mehkimi platnicami in lepljenim hrbtom) |
| Izdano | 23. avgusta 2016 |
| ISBN13 | 9783319374970 |
| Založniki | Springer International Publishing AG |
| Strani | 179 |
| Dimenzije | 155 × 235 × 10 mm · 276 g |
| Jezik | Nemščina |
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